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Synova Lgs Laser Edge Grinding Machines

Water jet guided laser cutting technology Synova

Turnkey Systems. Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet ® technology, perform fast, accurate, omni

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Metal cutting systems with water jet guided laser Synova

The LCS 50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet ® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.

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Water jet guided Laser MicroJet for semiconductor Synova

Synova’s unique water jet guided laser systems offer many advantages for applications in the semiconductor industry compared to conventional diamond blade saws or laser systems. The “gentle” Laser MicroJet (LMJ) method enables the cutting, grooving and dicing of sensitive materials resulting in smooth edges,high wafer fracture strength

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Advanced cutting, drilling, edge grinding and dicing solutions

Synova provides cutting, drilling, edge grinding and dicing solutions for a broad range of precision machining applications. All Synova systems are based on the unique water jet guided laser technology Laser MicroJet®.

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Medical Synova SA

The Synova water jet guided laser machines allow cool and clean cutting processes without heat affected zone, deposition, or burrs. In the medical sector, the Laser MicroJet is primarily used for the high-quality manufacturing of medical devices such as implants, blades, stents, tubes (i.e. cannulas, needles, or endoscopes) as well as

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Cool Laser Machining Synova

Innovative Laser Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and dicing solutions as well as drilling and edge grinding systems for the energy, aerospace, tool, diamond, semiconductor, watchmaking, elec-tronic, automotive and medical industries.

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Synova Receives Multiple-System Orders From Korean OLED

The first order was placed for Synova's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synova's penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge

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Company Profile Synova

Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and dicing solutions as well as drilling and edge grinding systems for the semiconduc-tor, electronic, automotive, energy, aerospace, watchmaking, tool, diamond and medical indus-tries. All Synova systems are based on our pa-

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Laser machines for cutting edge processing Drupal

Machine with ultra-short pulse laser processes hard materials high-precision, low-energy and without any thermal generation Specialist article EWAG I Fritz Studer AG, EWAG Zweigniederlassung

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Synova's success Electronics Case Study

The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar

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S Metal Watches EPMT-2015-english-swissphotonics

Synova Confidential Laser Microjet Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners Laser Cutting System (MCS) with Makino Tool Cutting / Turbine Drilling System (TCS / TDS 250) with Willemin-Macodel.

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LCS-50 Sai Impex

The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting, drill- ling, grooving or slicing.

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SYNOVA S.A. Drupal

Grinding machines for shank tools; Grinding wheel electroplated; Synova S.A., headquartered in Duillier, Switzerland, manufactures advanced laser cutting systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet) in a true industrial CNC platform. Laser machines for cutting edge processing. Get online

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Synova S.A. SMTnet

Synova s state-of-the-art machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress.

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Cutting Diamond Tools By Laser MicroJet Drupal

The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, which eliminates the need for a second grinding operation. In addition, the machine’s 5-axis capability is in a position to execute CNC programs with the high degree of precision needed for such cutting tools.

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Synova receives multiple-system orders from Korean

January 31--Synova announced tool orders from a Korean organic light-emitting diode (OLED) manufacturer and a leading U.S.-based semiconductor manufacturer's Korean facility.The first order was placed for the company's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin wafer edge grinding.

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Synova Receives Multiple-System Orders From Korean OLED

The first order was placed for Synova's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synova's penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge

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Compact laser-microjet cutting system with up to 5 axes

Jun 30, 2015· Lausanne, Switzerland Officials from Synova, a provider of advanced laser cutting solutions, are launching the company’s new LCS 50 machine, designed for machining diamond tools, medical components, watch components, and other small workpieces.The ultra-compact LCS 50 is available in a 3- or 5-axis configuration, offering fast cutting times, easy processing, and high

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New minerals mills in south africa

synova lgs laser edge grinding machines; small calcium carbonate sand washer in tokyo japan east asia; formula for wall putty; copper mining in nigeria; stone crusher plant on sale in india; tambang kuarsa dijual di srilanka; medium calcining ore mining equipment in maiduguri nigeria africa; aggregate crusher manufacturer india; crusher plant

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wirtschaft Synova SA Ecublens Waadt Kompetenzmarkt

Synova manufactures high-precision cutting systems based on the water-jet-guided laser technology. Telefon E-Mail Kompetenzmarkt: Der grösste KMU-Marktplatz der Schweiz mit 42 211 Firmen

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Precision cutting and grooving with the Laser MicroJet

Synova SA, Switzerland Precision cutting and grooving with the Laser MicroJet EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting / grooving of wafers Laser Stencil System (LSS) SYSTEM Machine type LCS300

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水导激光_图文_百度文库

平均功率10 W to 300 W. 水 去离子、去瓦斯过滤水 喷嘴直径 20-150微米 市场 SYNOVA的水导激光切割机系列 SYNOVA的水导激光加工设备 General purpose Loading system Dicing / trimming / scribing of wafers Laser Cutting System (LCS) Cutting of diamonds Laser Dicing System (LDS) Laser Edge-Grinding System (LGS) with

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The micro-machining evaluation of non-metallic materials

Jan 01, 2006· The field of laser machining is extremely diverse, and virtually all commercially available high power lasers have applications for which they are particularly suited [].Termed the Laser-Microjet® or LMJ by its developers Synova SA, this hybrid technology combines a high power laser and a low pressure water jet.

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